Water — lots of it — is a critical enabler for advanced chip architectures, lithography, and back-end packaging. It feeds the ultra-pure water loops that touch every wafer, sluicing heat out of tools ...

The semiconductor industry is a land of peaks and valleys. It’s a place where each innovation represents the culmination of a long and often difficult climb to the summit. In the case of glass ...

AI-driven compute demands have led to several distinct supply chain bottlenecks for data centers. Legacy power management ...

An Industry 4.0 technology roadmap for semiconductor device makers that covers carbon emissions, water, and hazardous waste.

Newer nonvolatile memory (NVM) technologies are poised to take over from flash in embedded applications on newer process ...

Fine-pitch hybrid bonding extends a proven production technology into a manufacturing regime with much smaller margins for particles, surface variation, distortion ...

AI opens the door to exploring a much larger solution space, similar to what high-level synthesis did years ago, but ...

As the semiconductor ecosystem pivots to AI, it is transforming how IP is created, verified, managed, and sold.

Hybrid bonding is essential for the interconnect density that high-bandwidth workloads require. Successful implementation depends on control of surface chemistry and surface topography — clean ...

A realistic virtual model uncovers the impact of rounded corners on sensitivity to overlay-induced resistance.

Quantum computing has imprinted itself on our society as a weird, wacky way of computing that most of us can’t comprehend.